Title :
Broadband coplanar couplers in multilayer thin film MCM-D technology
Author :
Pieters, P. ; Brebels, S. ; De Raedt, W. ; Beyne, E.
Author_Institution :
MCP/MCM Group, IMEC, Leuven, Belgium
Abstract :
Multilayer thin film multichip module technology (MCM-D) is very well suited for high density integration of microwave circuits. This paper focuses on the design and realization of broadband coplanar couplers in MCM-D. By applying a general quasi-static calculation method, the modal electrical parameters of the couplers may be calculated very fast, allowing a quick determination of the coupler geometry. Design verifications by measurements indicate that broadband couplers may be realized efficiently in MCM-D.
Keywords :
multichip modules; multilayers; waveguide couplers; broadband coplanar coupler; design; microwave integrated circuit; modal electrical parameters; multichip module; multilayer thin film MCM-D technology; quasi-static method; Conducting materials; Couplers; Frequency; MMICs; Microwave integrated circuits; Microwave technology; Nonhomogeneous media; Thin film circuits; Transistors; Transmission line matrix methods;
Conference_Titel :
Microwave Symposium Digest, 1999 IEEE MTT-S International
Conference_Location :
Anaheim, CA, USA
Print_ISBN :
0-7803-5135-5
DOI :
10.1109/MWSYM.1999.780302
