DocumentCode
3004844
Title
Estimating Soil Temperature at Given Depth Based on RS Image and Heat Conduction Model
Author
Lei, Shaogang ; Bian, Zhengfu
Author_Institution
Jiangsu Key Lab. of Resources & Environ. Inf. Eng., China Univ. of Min. & Technol., Xuzhou, China
fYear
2010
fDate
29-31 Oct. 2010
Firstpage
1
Lastpage
4
Abstract
Many satellite images with thermal infrared band can be used to obtain the ground surface temperature, but it is difficulty to get the underground soil temperature, which is a function of time and depth. The objective of this paper is to provide a solution to convert the ground temperature derived from RS image to the soil temperature at a given depth and obtain the soil temperature difference at a higher spatial resolution. Therefore, a soil temperature model based on the basic heat conduction equation was proposed. And it is suitable for the image with thermal infrared image, e.g. TM/ETM+, ASTER or CBERS-1 image. The RMSE of estimated soil temperature at depths of 10 cm and 40 cm are 1.534 K and 2.053 K, respectively. It is found that the deeper soil depth, the higher RMSE. Because the accuracy of the proposed method still depends on the ground soil temperature derived from RS image and the mean soil temperature derived from MODIS image.
Keywords
heat conduction; infrared imaging; land surface temperature; remote sensing; soil; ASTER images; CBERS-1 images; Landsat ETM+ images; Landsat TM images; MODIS image; basic heat conduction equation; depth 10 cm; depth 40 cm; ground surface temperature; heat conduction model; remote sensing image; soil temperature estimation; soil temperature model; thermal infrared band satellite images; underground soil temperature; Equations; Land surface temperature; MODIS; Mathematical model; Soil; Temperature measurement; Temperature sensors;
fLanguage
English
Publisher
ieee
Conference_Titel
Multimedia Technology (ICMT), 2010 International Conference on
Conference_Location
Ningbo
Print_ISBN
978-1-4244-7871-2
Type
conf
DOI
10.1109/ICMULT.2010.5631140
Filename
5631140
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