DocumentCode
3004894
Title
ESD and latch-up reliability for nanometer CMOS technologies
Author
Duvvury, Charvaka ; Boselli, Gianluca
Author_Institution
Silicon Technol. Dev., Texas Instrum., Dallas, TX, USA
fYear
2004
fDate
13-15 Dec. 2004
Firstpage
933
Lastpage
936
Abstract
Considerable research during the 80´s and 90´s laid the foundation for a deeper understanding of the ESD high current device physics and the subsequent protection design techniques required to achieve ESD reliability for numerous applications (Amerasekera and Duvvury, 2001; Dabral and Maloney,1998). Indeed, at every node a different parameter has had the most influencing effect, especially on ESD. This paper will review the recent trends as the industry moves towards nanometer technologies. New circuit applications are also discussed to introduce the upcoming critical issues for ESD and LU design.
Keywords
CMOS integrated circuits; electrostatic discharge; integrated circuit reliability; protection; ESD reliability; high current device physics; latch-up reliability; nanometer CMOS technology; protection design techniques; CMOS process; CMOS technology; Conductivity; Doping; Electrostatic discharge; Implants; MOS devices; Merging; Protection; Silicon;
fLanguage
English
Publisher
ieee
Conference_Titel
Electron Devices Meeting, 2004. IEDM Technical Digest. IEEE International
Print_ISBN
0-7803-8684-1
Type
conf
DOI
10.1109/IEDM.2004.1419337
Filename
1419337
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