• DocumentCode
    3004894
  • Title

    ESD and latch-up reliability for nanometer CMOS technologies

  • Author

    Duvvury, Charvaka ; Boselli, Gianluca

  • Author_Institution
    Silicon Technol. Dev., Texas Instrum., Dallas, TX, USA
  • fYear
    2004
  • fDate
    13-15 Dec. 2004
  • Firstpage
    933
  • Lastpage
    936
  • Abstract
    Considerable research during the 80´s and 90´s laid the foundation for a deeper understanding of the ESD high current device physics and the subsequent protection design techniques required to achieve ESD reliability for numerous applications (Amerasekera and Duvvury, 2001; Dabral and Maloney,1998). Indeed, at every node a different parameter has had the most influencing effect, especially on ESD. This paper will review the recent trends as the industry moves towards nanometer technologies. New circuit applications are also discussed to introduce the upcoming critical issues for ESD and LU design.
  • Keywords
    CMOS integrated circuits; electrostatic discharge; integrated circuit reliability; protection; ESD reliability; high current device physics; latch-up reliability; nanometer CMOS technology; protection design techniques; CMOS process; CMOS technology; Conductivity; Doping; Electrostatic discharge; Implants; MOS devices; Merging; Protection; Silicon;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electron Devices Meeting, 2004. IEDM Technical Digest. IEEE International
  • Print_ISBN
    0-7803-8684-1
  • Type

    conf

  • DOI
    10.1109/IEDM.2004.1419337
  • Filename
    1419337