DocumentCode :
3005215
Title :
Simulation of high-temperature millisecond annealing-based on atomistic modeling of boron diffusion/activation in silicon
Author :
Hane, M. ; Ikezawa, T. ; Matsuda, Tadamitsu ; Shishiguchi, S.
fYear :
2004
fDate :
13-15 Dec. 2004
Firstpage :
975
Lastpage :
978
Abstract :
An advanced annealing technique.where high temperature is applied for a ~ f ewm illiseconds was investigated through an atomistic process simulation program. In this basic study into the feasibility of this new annealing technique, our aim was to clarify what is happening under the ideal conceptual condition of high-temperature millisecond annealing.
Keywords :
Boron; Fitting; Ion implantation; Kinetic theory; MOSFET circuits; National electric code; Silicon; Simulated annealing; Temperature; Vehicles;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electron Devices Meeting, 2004. IEDM Technical Digest. IEEE International
Conference_Location :
San Francisco, CA
Print_ISBN :
0-7803-8684-1
Type :
conf
DOI :
10.1109/IEDM.2004.1419349
Filename :
1419349
Link To Document :
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