Title : 
Challenges for developing low-cost avionics/aerospace-grade optoelectronic modules
         
        
            Author : 
Chan, E.Y. ; Beranek, M.W. ; Davido, K.W. ; Hager, H.E. ; Hong, C.S. ; Pierre, R. L St
         
        
            Author_Institution : 
Res. & Technol., Boeing Defense & Space Group, Seattle, WA, USA
         
        
        
        
        
        
            Abstract : 
The commercial and military avionics/aerospace environment presents formidable challenges for developing and manufacturing low-cost avionics/aerospace-grade optoelectronic modules. Because manufacturing volume is relatively low, the economies of scale advantage enjoyed by commercial datacom optoelectronic module producers has yet to be realized. Currently the harsh avionics/aerospace environment obligates the hybrid designer to place highest priority on achieving very high performance and reliability, thus imposing stringent constraints for implementing potentially low-cost optoelectronic module designs in today´s military/aerospace hybrid manufacturing plant. Boeing´s collaborative R&D programs with commercial sector optoelectronics producers provides a solution for reducing optoelectronic module design and manufacturing production costs for future avionics/aerospace optoelectronic module applications
         
        
            Keywords : 
aerospace instrumentation; assembling; avionics; electronic equipment manufacture; modules; optoelectronic devices; packaging; aerospace-grade modules; cost reduction; low-cost avionics modules; manufacturing production costs; module design costs; optoelectronic modules; Aerospace electronics; Aerospace testing; Costs; Hardware; Light emitting diodes; Optical fiber communication; Optical fiber testing; Packaging; Seals; Transceivers;
         
        
        
        
            Conference_Titel : 
Electronic Components and Technology Conference, 1996. Proceedings., 46th
         
        
            Conference_Location : 
Orlando, FL
         
        
        
            Print_ISBN : 
0-7803-3286-5
         
        
        
            DOI : 
10.1109/ECTC.1996.550878