DocumentCode :
3006058
Title :
Power Module Design without Solder Interfaces - an Ideal Solution for Hybrid Vehicle Traction Applications
Author :
Scheuermann, U.
Author_Institution :
SEMIKRON Elektron. GmbH &Co. KG, Nuremberg
fYear :
2009
fDate :
15-19 Feb. 2009
Firstpage :
472
Lastpage :
478
Abstract :
Hybrid vehicle traction applications require compact power modules with high reliability. A major challenge is the lifetime under thermal cycles. While the requirements are moderate with respect to (active) power cycles, there are challenging requests for a high lifetime under (passive) temperature cycles. Base plates and solder interfaces limit the stability for temperature cycles in the classical module design. Advanced module architecture without base plate and without a single solder interface overcomes the limits of the classical module design and provides an ideal solution for hybrid automotive traction systems.
Keywords :
hybrid electric vehicles; power semiconductor devices; thermal expansion; traction motors; base plates; hybrid vehicle traction applications; power module design; solder interfaces; Automotive engineering; Ceramics; Copper; Heat sinks; Multichip modules; Shape; Solids; Temperature; Thermal stresses; Vehicles;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Applied Power Electronics Conference and Exposition, 2009. APEC 2009. Twenty-Fourth Annual IEEE
Conference_Location :
Washington, DC
ISSN :
1048-2334
Print_ISBN :
978-1-4244-2811-3
Electronic_ISBN :
1048-2334
Type :
conf
DOI :
10.1109/APEC.2009.4802700
Filename :
4802700
Link To Document :
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