Title :
Power Module Design without Solder Interfaces - an Ideal Solution for Hybrid Vehicle Traction Applications
Author_Institution :
SEMIKRON Elektron. GmbH &Co. KG, Nuremberg
Abstract :
Hybrid vehicle traction applications require compact power modules with high reliability. A major challenge is the lifetime under thermal cycles. While the requirements are moderate with respect to (active) power cycles, there are challenging requests for a high lifetime under (passive) temperature cycles. Base plates and solder interfaces limit the stability for temperature cycles in the classical module design. Advanced module architecture without base plate and without a single solder interface overcomes the limits of the classical module design and provides an ideal solution for hybrid automotive traction systems.
Keywords :
hybrid electric vehicles; power semiconductor devices; thermal expansion; traction motors; base plates; hybrid vehicle traction applications; power module design; solder interfaces; Automotive engineering; Ceramics; Copper; Heat sinks; Multichip modules; Shape; Solids; Temperature; Thermal stresses; Vehicles;
Conference_Titel :
Applied Power Electronics Conference and Exposition, 2009. APEC 2009. Twenty-Fourth Annual IEEE
Conference_Location :
Washington, DC
Print_ISBN :
978-1-4244-2811-3
Electronic_ISBN :
1048-2334
DOI :
10.1109/APEC.2009.4802700