• DocumentCode
    3006058
  • Title

    Power Module Design without Solder Interfaces - an Ideal Solution for Hybrid Vehicle Traction Applications

  • Author

    Scheuermann, U.

  • Author_Institution
    SEMIKRON Elektron. GmbH &Co. KG, Nuremberg
  • fYear
    2009
  • fDate
    15-19 Feb. 2009
  • Firstpage
    472
  • Lastpage
    478
  • Abstract
    Hybrid vehicle traction applications require compact power modules with high reliability. A major challenge is the lifetime under thermal cycles. While the requirements are moderate with respect to (active) power cycles, there are challenging requests for a high lifetime under (passive) temperature cycles. Base plates and solder interfaces limit the stability for temperature cycles in the classical module design. Advanced module architecture without base plate and without a single solder interface overcomes the limits of the classical module design and provides an ideal solution for hybrid automotive traction systems.
  • Keywords
    hybrid electric vehicles; power semiconductor devices; thermal expansion; traction motors; base plates; hybrid vehicle traction applications; power module design; solder interfaces; Automotive engineering; Ceramics; Copper; Heat sinks; Multichip modules; Shape; Solids; Temperature; Thermal stresses; Vehicles;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Applied Power Electronics Conference and Exposition, 2009. APEC 2009. Twenty-Fourth Annual IEEE
  • Conference_Location
    Washington, DC
  • ISSN
    1048-2334
  • Print_ISBN
    978-1-4244-2811-3
  • Electronic_ISBN
    1048-2334
  • Type

    conf

  • DOI
    10.1109/APEC.2009.4802700
  • Filename
    4802700