DocumentCode
3006652
Title
SiC Wirebond Multi-Chip Phase-Leg Module Packaging Design and Testing for Harsh Environment
Author
Ning, Puqi ; Lai, Rixin ; Huff, Daniel ; Wang, Fred ; Ngo, Khai D T
Author_Institution
Bradley Dept. of Electr. & Comput. Eng., Virginia Polytech. Inst. & State Univ., Blacksburg, VA
fYear
2009
fDate
15-19 Feb. 2009
Firstpage
631
Lastpage
636
Abstract
In order to take full advantage of SiC, a high temperature wirebond package for multi-chip phase-leg power module using SiC devices was designed, developed, fabricated and tested. The details of the material selection and thermo-mechanical reliability evaluation are described. High temperature power test shows that the package presented in this paper can perform well at the high junction temperature.
Keywords
lead bonding; power semiconductor devices; junction temperature; thermomechanical reliability evaluation; wirebond multichip phase-leg power module packaging design; Assembly; Electronic equipment testing; Electronics packaging; Materials reliability; Multichip modules; Semiconductor device packaging; Silicon carbide; System testing; Temperature; Thermomechanical processes;
fLanguage
English
Publisher
ieee
Conference_Titel
Applied Power Electronics Conference and Exposition, 2009. APEC 2009. Twenty-Fourth Annual IEEE
Conference_Location
Washington, DC
ISSN
1048-2334
Print_ISBN
978-1-4244-2811-3
Electronic_ISBN
1048-2334
Type
conf
DOI
10.1109/APEC.2009.4802725
Filename
4802725
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