Title :
Reliability characterization of the SLICC package
Author :
Lall, Pradeep ; Gold, Glenn ; Miles, Barry ; Banerji, Kingshuk ; Thompson, Pat ; Koehler, Corey ; Adhihetty, Indira
Author_Institution :
Adv. Manuf. Technol. Center, Motorola Inc., Plantation, FL, USA
Abstract :
SLICC (Slightly Larger than IC Carrier) is a chip-scale ball grid array (BGA) package currently under development at Motorola. The SLICC package consists of a solder-bumped integrated circuit (IC) which is flip-chip bonded to an interposer substrate-approximately 8 mils thick-and then underfilled with an encapsulant. Chip I/Os are routed to package I/Os through plated through holes (PTHs) in the interposer substrate. Package I/Os are composed of solder bumps (approx. 22.2 mils in diameter on a 32-mil pitch) attached to the bottom side of the interposer substrate. The most apparent benefit of the SLICC package is its utilization of the area efficiency associated with direct chip attach (DCA) technology, coupled with the assembly, test, and repair simplicity afforded by BGA-type packaging
Keywords :
failure analysis; flip-chip devices; integrated circuit packaging; integrated circuit reliability; microassembling; reflow soldering; reliability theory; thermal stress cracking; DCA technology; Motorola; PTH; SLICC package; ball grid array; chip-scale BGA package; direct chip attach technology; encapsulant; flip-chip bonding; interposer substrate; plated through holes; reliability characterization; solder joint reliability; solder-bumped integrated circuit; thermal fatigue; underfilling; Assembly; Bonding; Electronics packaging; Gold; Integrated circuit packaging; Semiconductor device packaging; Soldering; Space technology; Substrates; Temperature;
Conference_Titel :
Electronic Components and Technology Conference, 1996. Proceedings., 46th
Conference_Location :
Orlando, FL
Print_ISBN :
0-7803-3286-5
DOI :
10.1109/ECTC.1996.550888
