A post processing method for reducing substrate coupling in mixed-signal integrated circuits

Author

Basedau, Philipp ; Huang, Qiuting

Author_Institution

Integrated Syst. Lab., Swiss Federal Inst. of Technol., Zurich, Switzerland

fYear

1995

fDate

8-10 June 1995

Firstpage

41

Lastpage

42

Abstract

Due to the heavily doped substrate material in modern MOS technologies, digital interference couples to sensitive analog nodes much more easily than in technologies with p/sup -/ substrates. The guard ring method of isolating sensitive nodes is no longer as effective as before. In this contribution we investigate the isolation of analog circuits by etching a gap between analog and digital circuits from the back of the wafer. Experiments show that interference coupling 35 dB above noise floor is completely removed when a gap is etched around the analog circuit.

Keywords

MOS integrated circuits; etching; integrated circuit noise; integrated circuit technology; mixed analogue-digital integrated circuits; MOS technologies; digital interference; etching; heavily doped substrate material; interference coupling; mixed-signal integrated circuits; noise floor; sensitive analog nodes; substrate coupling; Analog circuits; CMOS technology; Circuit noise; Coupling circuits; Digital circuits; Integrated circuit technology; Isolation technology; Mixed analog digital integrated circuits; RLC circuits; Silicon on insulator technology;

fLanguage

English

Publisher

ieee

Conference_Titel

VLSI Circuits, 1995. Digest of Technical Papers., 1995 Symposium on

Conference_Location

Kyoto, Japan

Print_ISBN

0-7800-2599-0

Type

conf

DOI

10.1109/VLSIC.1995.520679

Filename

520679