Title :
A modular two-axis compliant parallel micropositioning stage with long travel range
Author_Institution :
Dept. of Electromech. Eng., Univ. of Macau, Macao, China
Abstract :
Micropositioning systems with the properties of long travel range, compact physical size and high accuracy are required in many precision engineering applications. This paper presents the design, fabrication and testing of a novel two-axis compliant parallel-kinematics precision positioning stage with a centimeter stroke and compact size. Different from existing work, the presented stage owns a much compact dimension which is enabled by a concept of modular design. The proposed compact design permits positioning applications inside a constrained space. The stage performances in terms of motion range, stiffness and resonant frequency are verified through finite element analysis with simulations. A prototype is fabricated by using voice coil motors and laser displacement sensors for driving and sensing, respectively. Experimental results show that the stage is capable of submicron-resolution positioning with a range over 11 mm in each axis. Moreover, the stage exhibits negligible static and dynamic crosstalks, which are better than 0.75% and -33 dB, respectively.
Keywords :
compliant mechanisms; design engineering; finite element analysis; micropositioning; precision engineering; sensors; axis compliant parallel-kinematics precision positioning stage; dynamic crosstalks; finite element analysis; laser displacement sensors; micropositioning systems; modular two-axis compliant parallel micropositioning stage; motion range; physical size property; precision engineering; resonant frequency; static crosstalks; stiffness; submicron-resolution positioning; travel range property; voice coil motors; Actuators; Force; Materials; Prototypes; Resonant frequency; Sensors; Stress; Precision positioning; compliant mechanisms; flexure mechanisms; mechanism design;
Conference_Titel :
Information and Automation (ICIA), 2013 IEEE International Conference on
Conference_Location :
Yinchuan
DOI :
10.1109/ICInfA.2013.6720421