DocumentCode
3007266
Title
A study of radiation heating during the curing process of head gimbal assembly
Author
Aksornnium, Suttipan ; Watcharakitchakorn, Orrathai ; Silapunt, Rardchawadee
Author_Institution
Dept. of Electron. & Telecommun. Eng., King Mongkut´´s Univ. of Technol. Thonburi, Bangkok, Thailand
fYear
2011
fDate
21-24 Nov. 2011
Firstpage
725
Lastpage
728
Abstract
Thermal radiation characteristics of materials associated with their interactions in the electromagnetic (EM) curing process of head gimbal assembly (HGA) are studied to identify process factors involving a random soft electrostatic discharge (ESD) of a read sensor that is located on a slider. The oven temperature measurement with K-type grounded thermocouples that are also used regularly as real-time and non-contact slider temperature measuring tools, show relatively higher temperature in the center of the carrier than its both ends. It is then shown from the two-dimensional (2D) model that the center slider temperatures are apparently different when different types of thermocouples are used. The center slider´s peak temperature increases steadily with a decrease in the suspension´s thickness and width, and, in some cases, is higher than ones measured by the thermocouple.
Keywords
curing; disc drives; electrostatic discharge; hard discs; heat radiation; thermocouples; HDD industry; K-type grounded thermocouples; electromagnetic curing process; electrostatic discharge; hard disk drive; head gimbal assembly; radiation heating; temperature measurement; thermal radiation; two-dimensional model; Curing; Materials; Ovens; Steel; Suspensions; Temperature measurement; Temperature sensors; Blocking Temperature; Head Gimbal Assembly; Read Layers; Thermal Radiation;
fLanguage
English
Publisher
ieee
Conference_Titel
TENCON 2011 - 2011 IEEE Region 10 Conference
Conference_Location
Bali
ISSN
2159-3442
Print_ISBN
978-1-4577-0256-3
Type
conf
DOI
10.1109/TENCON.2011.6129204
Filename
6129204
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