• DocumentCode
    3007266
  • Title

    A study of radiation heating during the curing process of head gimbal assembly

  • Author

    Aksornnium, Suttipan ; Watcharakitchakorn, Orrathai ; Silapunt, Rardchawadee

  • Author_Institution
    Dept. of Electron. & Telecommun. Eng., King Mongkut´´s Univ. of Technol. Thonburi, Bangkok, Thailand
  • fYear
    2011
  • fDate
    21-24 Nov. 2011
  • Firstpage
    725
  • Lastpage
    728
  • Abstract
    Thermal radiation characteristics of materials associated with their interactions in the electromagnetic (EM) curing process of head gimbal assembly (HGA) are studied to identify process factors involving a random soft electrostatic discharge (ESD) of a read sensor that is located on a slider. The oven temperature measurement with K-type grounded thermocouples that are also used regularly as real-time and non-contact slider temperature measuring tools, show relatively higher temperature in the center of the carrier than its both ends. It is then shown from the two-dimensional (2D) model that the center slider temperatures are apparently different when different types of thermocouples are used. The center slider´s peak temperature increases steadily with a decrease in the suspension´s thickness and width, and, in some cases, is higher than ones measured by the thermocouple.
  • Keywords
    curing; disc drives; electrostatic discharge; hard discs; heat radiation; thermocouples; HDD industry; K-type grounded thermocouples; electromagnetic curing process; electrostatic discharge; hard disk drive; head gimbal assembly; radiation heating; temperature measurement; thermal radiation; two-dimensional model; Curing; Materials; Ovens; Steel; Suspensions; Temperature measurement; Temperature sensors; Blocking Temperature; Head Gimbal Assembly; Read Layers; Thermal Radiation;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    TENCON 2011 - 2011 IEEE Region 10 Conference
  • Conference_Location
    Bali
  • ISSN
    2159-3442
  • Print_ISBN
    978-1-4577-0256-3
  • Type

    conf

  • DOI
    10.1109/TENCON.2011.6129204
  • Filename
    6129204