DocumentCode :
3007674
Title :
Dense Matrix Factorization of Linear Complexity for Impedance Extraction of Large-Scale 3-D Integrated Circuits
Author :
Chai, Wenwen ; Jiao, Dan
Author_Institution :
Sch. of Electr. & Comput. Eng., Purdue Univ., West Lafayette, IN, USA
fYear :
2010
fDate :
June 28 2010-July 1 2010
Firstpage :
1
Lastpage :
5
Abstract :
A fast LU factorization of linear complexity is developed to directly solve a dense system of linear equations for the interconnect extraction of any arbitrary shaped 3-D structure embedded in inhomogeneous materials. The proposed solver successfully factorizes dense matrices that involve more than one million unknowns in fast CPU run time and modest memory consumption. Comparisons with state-of-the-art integral-equation-based interconnect extraction tools have demonstrated its clear advantages.
Keywords :
integral equations; integrated circuit interconnections; matrix decomposition; three-dimensional integrated circuits; LU factorization; dense matrix factorization; impedance extraction; integral equation-based interconnect extraction; large-scale 3D integrated circuits; linear complexity; Central Processing Unit; Computational complexity; Electronics industry; Embedded computing; Impedance; Integral equations; Integrated circuit interconnections; Large scale integration; Sparse matrices; Three-dimensional integrated circuits;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Micro/Nano Symposium (UGIM), 2010 18th Biennial University/Government/Industry
Conference_Location :
West Lafayette, IN
ISSN :
0749-6877
Print_ISBN :
978-1-4244-4731-2
Electronic_ISBN :
0749-6877
Type :
conf
DOI :
10.1109/UGIM.2010.5508930
Filename :
5508930
Link To Document :
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