DocumentCode
3008193
Title
Foil covered PACkage (FPAC): a new package concept
Author
Hotta, Yuji ; Sigyo, Hitomi ; Kondo, Seiji ; Oizumi, Shinichi
Author_Institution
Core Technol. Center, Nitto Denko Corp., Ibaraki, Japan
fYear
1996
fDate
28-31 May 1996
Firstpage
1258
Lastpage
1264
Abstract
This paper describes the Foil covered PACkage (FPAC) technology developed by Nitto Denko. This concept involves using a thin metal foil on the package. Consequently the package can show very high solder resistance. An improvement of the laser marking, a reduction in the warpage of the package are some of the other advantages of this technology. The concept can also be adapted to provide an EMI shield
Keywords
deformation; electromagnetic interference; electromagnetic shielding; foils; integrated circuit packaging; moisture; surface mount technology; EMI shield; FPAC; Nitto Denko; foil covered package; high solder resistance; laser marking; thin metal foil; warpage reduction; Absorption; Displays; Elasticity; Lead; Manufacturing processes; Moisture; Semiconductor device packaging; Semiconductor lasers; Stress; Surface resistance;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 1996. Proceedings., 46th
Conference_Location
Orlando, FL
ISSN
0569-5503
Print_ISBN
0-7803-3286-5
Type
conf
DOI
10.1109/ECTC.1996.550896
Filename
550896
Link To Document