Title :
Flex tape ball grid array
Author :
Karnezos, Marcos ; Goetz, Martin ; Dong, Fred ; Ciaschi, Andrew ; Chidambaram, N.
Author_Institution :
ASAT Inc., Palo Alto, CA, USA
Abstract :
Flex Tape Ball Grid Array (FTBGA) is a family of cavity down BGAs. The die, the flex tape and the solder balls are attached to the bottom side of a metallic heatspreader that acts as the stiffener and carrier of the package. The die is wire bonded to the tape traces and then encapsulated. The thermal and electrical performance and reliability are clearly superior to the alternative Plastic Ball Grid Arrays (PBGAs), the conventional plastic and thermally enhanced QFPs. The packages are constructed from materials that are well established in the industry. They are assembled using the same equipment, tools and processes as for the assembly of PBGAs
Keywords :
encapsulation; integrated circuit packaging; integrated circuit reliability; lead bonding; microassembling; reflow soldering; thermal resistance; ball grid array; cavity down BGAs; electrical performance; encapsulation; flex tape BGA package; metallic heatspreader; reliability; solder balls; thermal performance; wire bonding; Assembly; Bonding; Copper; Costs; Electronics packaging; Etching; Packaging machines; Plastics; Thermal resistance; Wire;
Conference_Titel :
Electronic Components and Technology Conference, 1996. Proceedings., 46th
Conference_Location :
Orlando, FL
Print_ISBN :
0-7803-3286-5
DOI :
10.1109/ECTC.1996.550898
