Screen printed adhesive technologies for all-silicon optical packaging

An all-silicon optical packaging method is a promising candidate for compact, low cost optical modules. In our previous work, we demonstrated a silicon packaged laser module that was sealed with adhesive. However, our adhesive sealing process yield was not high. In this paper, a screen printing technique is proposed as a new approach to improve the adhesive process. This screen printing method allows for better module fabrication stability. The productivity is also improved with a yield of more than 90% in all assembly processes. Moreover, stable optical coupling over a wide temperature range and good sealing characteristics have been obtained