Title :
Dual Wavelength Femtosecond Laser Materials Processing
Author :
Kamata, Masanao ; Tsujikawa, Susumu ; SUMIYOSHI, Tetusmi ; Sekita, Hitoshi
Author_Institution :
Cyber Laser Inc., Tokyo
Abstract :
Femtosecond laser ablation using the combination of 260 nm pulses and 780 nm pulses is explored for the high speed and high quality selected removal of insulating layers.
Keywords :
high-speed optical techniques; insulating materials; laser ablation; dual wavelength femtosecond laser materials processing; femtosecond laser ablation; high quality selected removal; high speed processing; insulating layers; wavelength 260 nm; wavelength 780 nm; Absorption; Delay effects; Insulation; Laser ablation; Materials processing; Optical materials; Optical pulses; Pulse amplifiers; Ultrafast electronics; Ultrafast optics;
Conference_Titel :
Lasers and Electro-Optics, 2007. CLEO 2007. Conference on
Conference_Location :
Baltimore, MD
Print_ISBN :
978-1-55752-834-6
DOI :
10.1109/CLEO.2007.4452824
