• DocumentCode
    3009970
  • Title

    Miniature ice detection sensor systems for aerospace applications

  • Author

    Roy, S. ; DeAnna, R.G. ; Izad, A. ; Mehregany, M.

  • Author_Institution
    Microfabrication Lab., Case Western Reserve Univ., Cleveland, OH, USA
  • fYear
    1998
  • fDate
    25-29 Jan 1998
  • Firstpage
    75
  • Lastpage
    80
  • Abstract
    Ice detection systems using microfabricated diaphragms as sensing elements and portable capacitance detection circuitry are presented. Finite element analysis (FEA) is used to optimize the sensor geometry for enhanced sensitivity to ice accretion. The sensors are fabricated by bulk micromachining and wafer bonding of silicon and glass substrates. During operation, actuation forces are applied electrostatically to cause diaphragm deformation. Accumulation of ice on a diaphragm leads to an increase in its effective stiffness. Therefore, for a given actuation voltage, an ice-covered diaphragm exhibits a smaller deflection than a corresponding ice-free diaphragm. This deflection is measured using a customized, portable, high-sensitivity, differential capacitance measurement circuit. The sensors are operated with the diaphragms in their stiffness-sensitive mode, enabling discrimination between ice and water (or deicing fluids) films. Calibration experiments reveal that the miniature ice detection sensor system can successfully detect ice and water film thicknesses between approximately 0.5-1.5 mm. Finally, dynamic testing indicates that adhesion of ice to silicon is poor when the sensor is driven continuously
  • Keywords
    aircraft instrumentation; calibration; capacitance measurement; diaphragms; dynamic testing; electric sensing devices; finite element analysis; ice; microsensors; semiconductor device packaging; thickness measurement; H2O; Miniature ice detection sensor; Si; actuation voltage; adhesion; aerospace applications; bulk micromachining; calibration experiments; deicing fluids films; diaphragm deformation; dynamic testing; effective stiffness; enhanced sensitivity; finite element analysis; glass substrates; ice accretion; ice detection; ice-covered diaphragm; microfabricated diaphragms; portable capacitance detection circuitry; portable capacitance measurement; sensing elements; sensor geometry; stiffness-sensitive mode; wafer bonding; Capacitance measurement; Circuits; Finite element methods; Geometry; Glass; Ice; Micromachining; Sensor systems; Silicon; Wafer bonding;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Micro Electro Mechanical Systems, 1998. MEMS 98. Proceedings., The Eleventh Annual International Workshop on
  • Conference_Location
    Heidelberg
  • ISSN
    1084-6999
  • Print_ISBN
    0-7803-4412-X
  • Type

    conf

  • DOI
    10.1109/MEMSYS.1998.659732
  • Filename
    659732