DocumentCode :
3009970
Title :
Miniature ice detection sensor systems for aerospace applications
Author :
Roy, S. ; DeAnna, R.G. ; Izad, A. ; Mehregany, M.
Author_Institution :
Microfabrication Lab., Case Western Reserve Univ., Cleveland, OH, USA
fYear :
1998
fDate :
25-29 Jan 1998
Firstpage :
75
Lastpage :
80
Abstract :
Ice detection systems using microfabricated diaphragms as sensing elements and portable capacitance detection circuitry are presented. Finite element analysis (FEA) is used to optimize the sensor geometry for enhanced sensitivity to ice accretion. The sensors are fabricated by bulk micromachining and wafer bonding of silicon and glass substrates. During operation, actuation forces are applied electrostatically to cause diaphragm deformation. Accumulation of ice on a diaphragm leads to an increase in its effective stiffness. Therefore, for a given actuation voltage, an ice-covered diaphragm exhibits a smaller deflection than a corresponding ice-free diaphragm. This deflection is measured using a customized, portable, high-sensitivity, differential capacitance measurement circuit. The sensors are operated with the diaphragms in their stiffness-sensitive mode, enabling discrimination between ice and water (or deicing fluids) films. Calibration experiments reveal that the miniature ice detection sensor system can successfully detect ice and water film thicknesses between approximately 0.5-1.5 mm. Finally, dynamic testing indicates that adhesion of ice to silicon is poor when the sensor is driven continuously
Keywords :
aircraft instrumentation; calibration; capacitance measurement; diaphragms; dynamic testing; electric sensing devices; finite element analysis; ice; microsensors; semiconductor device packaging; thickness measurement; H2O; Miniature ice detection sensor; Si; actuation voltage; adhesion; aerospace applications; bulk micromachining; calibration experiments; deicing fluids films; diaphragm deformation; dynamic testing; effective stiffness; enhanced sensitivity; finite element analysis; glass substrates; ice accretion; ice detection; ice-covered diaphragm; microfabricated diaphragms; portable capacitance detection circuitry; portable capacitance measurement; sensing elements; sensor geometry; stiffness-sensitive mode; wafer bonding; Capacitance measurement; Circuits; Finite element methods; Geometry; Glass; Ice; Micromachining; Sensor systems; Silicon; Wafer bonding;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Micro Electro Mechanical Systems, 1998. MEMS 98. Proceedings., The Eleventh Annual International Workshop on
Conference_Location :
Heidelberg
ISSN :
1084-6999
Print_ISBN :
0-7803-4412-X
Type :
conf
DOI :
10.1109/MEMSYS.1998.659732
Filename :
659732
Link To Document :
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