DocumentCode
3010425
Title
A suspended microchannel with integrated temperature sensors for high-pressure flow studies
Author
Wu, S. ; Mai, J. ; Zohar, Y. ; Tai, Y.C. ; Ho, C.M.
Author_Institution
Dept. of Electr. Eng., California Inst. of Technol., Pasadena, CA, USA
fYear
1998
fDate
25-29 Jan 1998
Firstpage
87
Lastpage
92
Abstract
A freestanding microchannel, with integrated temperature sensors, has been developed for high-pressure flow studies. These microchannels are approximately 20 μm×2 μm×4400 μm, and are suspended above 80 μm deep cavities, bulk micromachined using BrF3 dry etch. The calibration of the lightly boron-doped thermistor-type sensors shows that the resistance sensitivity of these integrated sensors is parabolic with respect to temperature and linear with respect to pressure. Volumetric flow rates of NZ in the microchannel were measured at inlet pressures up to 578 psig. The discrepancy between the data and theory results from the flow acceleration in a channel, the nonparabolic velocity profile, and the bulging of the channel. Bulging effects were evaluated by using incompressible water flow measurements, which also measures 1.045×10-3N-s/m2 for the viscosity of DI water. The temperature data from sensors on the channel shows the heating of the channel due to the friction generated by the high-pressure flow inside
Keywords
boron compounds; calibration; flow measurement; high-pressure techniques; microsensors; semiconductor technology; temperature measurement; temperature sensors; thermistors; 2 mum; 20 mum; 4400 mum; BrF3; BrF3 dry etch; N2; bulging; calibration; flow acceleration; freestanding microchannel; high-pressure flow; incompressible water flow measurement; integrated sensors; integrated temperature sensors; nonparabolic velocity profile; resistance sensitivity; suspended microchannel; temperature data; thermistor; volumetric flow rates; Acceleration; Calibration; Dry etching; Electrical resistance measurement; Fluid flow measurement; Microchannel; Temperature sensors; Thermal resistance; Thermal sensors; Volume measurement;
fLanguage
English
Publisher
ieee
Conference_Titel
Micro Electro Mechanical Systems, 1998. MEMS 98. Proceedings., The Eleventh Annual International Workshop on
Conference_Location
Heidelberg
ISSN
1084-6999
Print_ISBN
0-7803-4412-X
Type
conf
DOI
10.1109/MEMSYS.1998.659734
Filename
659734
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