DocumentCode :
3010871
Title :
Bipolar ESD power clamp in high voltage CMOS based on TCAD device simulation
Author :
Betak, Petr
Author_Institution :
Dept. of Microelectron., BUT, Brno, Czech Republic
fYear :
2009
fDate :
13-17 May 2009
Firstpage :
1
Lastpage :
3
Abstract :
The paper contributes a specific way to form bipolar ESD power clamp in high voltage CMOS technologies. The CMOS technology cannot use efficient bipolar structures but only the parasitic structures. Here, the functional ESD power clamp is introduced which has higher holding voltage than conventional structures in CMOS. The higher holding voltage is very necessary for power clamps. The structure were formed and simulated in TCAD device simulator and manufactured in high voltage CMOS process.
Keywords :
CMOS integrated circuits; bipolar transistor switches; electrostatic devices; electrostatic discharge; power integrated circuits; technology CAD (electronics); BJT switch; TCAD device simulator; bipolar ESD power clamp; bipolar transistor switch; high voltage CMOS technologies; holding voltage; parasitic structures; CMOS process; CMOS technology; Clamps; Electrostatic discharge; Leakage current; Manufacturing processes; Silicon; Switches; Virtual manufacturing; Voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics Technology, 2009. ISSE 2009. 32nd International Spring Seminar on
Conference_Location :
Brno
Print_ISBN :
978-1-4244-4260-7
Type :
conf
DOI :
10.1109/ISSE.2009.5206981
Filename :
5206981
Link To Document :
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