Title :
An approach to measurement and evaluation of the thermal conductivity of the thermal adhesives in electronic packaging
Author :
Falat, Tomasz ; Platek, Bartosz ; Tesarski, Sebastian ; Felba, Jan
Author_Institution :
Fac. of Microsyst. Electron. & Photonics, Wroclaw Univ. of Technol., Wroclaw, Poland
Abstract :
In the following paper the measurement method of thermal conductivity is described. This method was especially designed for measuring the thermal conductivity of the thermal adhesives. The principal informations about heat transfer are given, and the experimental setup, mathematical model of experiment and its uncertainty with 95% of probability are shown. The thermal conductivity of polymer based material filled in 0.5% with carbon nanotubes is measured.
Keywords :
carbon nanotubes; conductive adhesives; electronics packaging; heat transfer; measurement uncertainty; polymers; thermal conductivity measurement; carbon nanotubes; electronic packaging; heat transfer; microelectronics; thermal conductivity measurement; thermally conductive adhesives; uncertainty measurement; Conducting materials; Conductivity measurement; Design methodology; Electronic packaging thermal management; Electronics packaging; Heat transfer; Mathematical model; Organic materials; Polymers; Thermal conductivity;
Conference_Titel :
Electronics Technology, 2009. ISSE 2009. 32nd International Spring Seminar on
Conference_Location :
Brno
Print_ISBN :
978-1-4244-4260-7
DOI :
10.1109/ISSE.2009.5207017
