Title :
A MEMS electrostatic particle transportation system
Author :
Desai, A. ; Lee, S.W. ; Tai, Y.C.
Author_Institution :
Caltech Micromachining Lab., California Inst. of Technol., Pasadena, CA, USA
Abstract :
We demonstrate here an electrostatic MEMS system capable of transporting particles 5-10 μm in diameter in air. This system consists of 3-phase electrode arrays covered by insulators. Extensive testing of this system has been done using a variety of insulation materials (silicon nitride, photoresist, and Teflon), thickness (0-12 μm), particle sizes (1-10 μm), particle materials (metal, glass, polystyrene, spores, etc.), waveforms, frequencies, and voltages. Although previous literature claimed it impractical to electrostatically transport particles with sizes 5-10 μm due to complex surface forces, this effort actually shows it feasible (as high as 90% efficiency) with the optimal combination of insulation thickness, electrode geometry, and insulation material. Moreover, we suggest a qualitative theory for our particle transportation system which is consistent with our data and finite-element electrostatic simulations
Keywords :
electrostatic devices; finite element analysis; glass; insulating coatings; microelectrodes; micromechanical devices; photoresists; polymer films; silicon compounds; transportation; 0 to 12 mum; 1 to 10 mum; 3-phase electrode arrays; 5 to 10 mum; 90 percent; MEMS electrostatic particle transportation; SiN; SiO2; Teflon; air; complex surface forces; electrode geometry; finite-element electrostatic simulation; glass; insulation materials; metal; particle materials; particle size; photoresist; polystyrene; spores; testing; Electrodes; Electrostatics; Inorganic materials; Insulation testing; Materials testing; Micromechanical devices; Resists; Silicon; System testing; Transportation;
Conference_Titel :
Micro Electro Mechanical Systems, 1998. MEMS 98. Proceedings., The Eleventh Annual International Workshop on
Conference_Location :
Heidelberg
Print_ISBN :
0-7803-4412-X
DOI :
10.1109/MEMSYS.1998.659740