• DocumentCode
    3011730
  • Title

    Electro ultrasonic spectroscopy of cermet thick films

  • Author

    Tofel, P. ; Sikula, J. ; Sedlakova, V. ; Chvatal, M.

  • Author_Institution
    Dept. of Phys., Univ. of Technol., Brno, Brno, Czech Republic
  • fYear
    2009
  • fDate
    13-17 May 2009
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    The electro-ultrasonic spectroscopy is non-destructive testing method for cermet resistors. This method can be used as a diagnostic tool for the quality and reliability assessment. AC current varying with frequency fE and the ultrasonic signal varying with frequency fU are applied on the conducting sample and a new intermodulation signal on the frequency fm given by the superposition or subtraction of exciting frequencies is measured on the sample. The sample resistance is influenced by the ultrasonic signal. The ultrasonic signal changes the contact area between the conducting grains in the sample structure and then resistance is modulated by the frequency of ultrasonic excitation. The electrical charge and also the electrical current flowing through the sample structure are conserved. In case the contact area between the conducting grains is changing then the current density is changed. This leads to the resistivity change of measured structure. We suppose that for the sample with more defects in the structure the influence of the ultrasonic signal is more pronounced and the resistance change is higher.
  • Keywords
    cermets; electron device testing; electronics packaging; nondestructive testing; reliability; thick film resistors; cermet thick films; current density; defects; electro-ultrasonic spectroscopy; intermodulation signal; nondestructive testing; Ceramics; Contacts; Electric resistance; Electrical resistance measurement; Frequency; Nondestructive testing; Resistors; Spectroscopy; Thick films; Ultrasonic variables measurement;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics Technology, 2009. ISSE 2009. 32nd International Spring Seminar on
  • Conference_Location
    Brno
  • Print_ISBN
    978-1-4244-4260-7
  • Type

    conf

  • DOI
    10.1109/ISSE.2009.5207025
  • Filename
    5207025