• DocumentCode
    3011946
  • Title

    Thermal conductivity and dielectric properties of epoxy composites with hyperbranched polymer modified boron nitride nanoplatelets

  • Author

    Xingyi Huang ; Peng Peng ; Wenyi Peng ; Jinhong Yu ; Fei Liu ; Pingkai Jiang

  • Author_Institution
    Dept. of Polymer Sci. & Eng., Shanghai Jiao Tong Univ., Shanghai, China
  • fYear
    2012
  • fDate
    23-27 Sept. 2012
  • Firstpage
    1089
  • Lastpage
    1092
  • Abstract
    In this work, by using a hyperbranched aromatic polyamide grafted boron nitride nanoplatelets (BNNP-HBP), epoxy nanocomposites with high thermal conductivity and high breakdown strength are successfully prepared. All the composite samples with less than 40 wt% BNNP-HBP show increased thermal conductivity and breakdown strength when compared the pure epoxy resin and the composites with as received BNNPs. The dielectric measurements also show that the incorporation of BNNPS does not affect the dielectric constant and dielectric loss tangent of the composites.
  • Keywords
    boron compounds; dielectric losses; filled polymers; nanocomposites; permittivity; thermal conductivity; BN; dielectric constant; dielectric loss tangent; dielectric measurement; dielectric property; epoxy nanocomposite; high breakdown strength; hyperbranched aromatic polyamide grafted boron nitride nanoplatelet; hyperbranched polymer modified boron nitride nanoplatelet; pure epoxy resin; thermal conductivity; Conductivity; Dielectric constant; Electric breakdown; Epoxy resins; Polymers; Thermal conductivity; boron nitride nanoplatelets; breakdown strength; epoxy; nanocomposites; thermal conductivity;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Condition Monitoring and Diagnosis (CMD), 2012 International Conference on
  • Conference_Location
    Bali
  • Print_ISBN
    978-1-4673-1019-2
  • Type

    conf

  • DOI
    10.1109/CMD.2012.6416347
  • Filename
    6416347