DocumentCode
3011946
Title
Thermal conductivity and dielectric properties of epoxy composites with hyperbranched polymer modified boron nitride nanoplatelets
Author
Xingyi Huang ; Peng Peng ; Wenyi Peng ; Jinhong Yu ; Fei Liu ; Pingkai Jiang
Author_Institution
Dept. of Polymer Sci. & Eng., Shanghai Jiao Tong Univ., Shanghai, China
fYear
2012
fDate
23-27 Sept. 2012
Firstpage
1089
Lastpage
1092
Abstract
In this work, by using a hyperbranched aromatic polyamide grafted boron nitride nanoplatelets (BNNP-HBP), epoxy nanocomposites with high thermal conductivity and high breakdown strength are successfully prepared. All the composite samples with less than 40 wt% BNNP-HBP show increased thermal conductivity and breakdown strength when compared the pure epoxy resin and the composites with as received BNNPs. The dielectric measurements also show that the incorporation of BNNPS does not affect the dielectric constant and dielectric loss tangent of the composites.
Keywords
boron compounds; dielectric losses; filled polymers; nanocomposites; permittivity; thermal conductivity; BN; dielectric constant; dielectric loss tangent; dielectric measurement; dielectric property; epoxy nanocomposite; high breakdown strength; hyperbranched aromatic polyamide grafted boron nitride nanoplatelet; hyperbranched polymer modified boron nitride nanoplatelet; pure epoxy resin; thermal conductivity; Conductivity; Dielectric constant; Electric breakdown; Epoxy resins; Polymers; Thermal conductivity; boron nitride nanoplatelets; breakdown strength; epoxy; nanocomposites; thermal conductivity;
fLanguage
English
Publisher
ieee
Conference_Titel
Condition Monitoring and Diagnosis (CMD), 2012 International Conference on
Conference_Location
Bali
Print_ISBN
978-1-4673-1019-2
Type
conf
DOI
10.1109/CMD.2012.6416347
Filename
6416347
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