• DocumentCode
    3011950
  • Title

    Analyze of the environment temperature effect over hydro-energetic buildings resistive transducers

  • Author

    Pop, S. ; Pitica, D. ; Ciascai, I. ; Bande, V.

  • Author_Institution
    Fac. of Electron., Telecommun. & Inf. Technol., Tech. Univ. of Cluj-Napoca, Cluj-Napoca, Romania
  • fYear
    2009
  • fDate
    13-17 May 2009
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    This paper makes a thermal study of a portable temperature measurement device under the influence of environment temperature. The portable device is used to measure sensors placed inside and outside of a hydro-energetic building (dams), where the ambient temperature range is between - 20degCdivide35degC. The self-heating phenomenon of electronics components cumulated with the ambient temperature increases the packaging temperature which affects the device measurement procedure. The usual electronic component that is affected by temperature variation is the resistor and the analog to digital convector, but the most significant error is caused by resistors. A through hole resistor used as a reference, with temperature coefficient of 10ppm/degC and tolerance of 1%, generates a measurement temperature error of 2.5degC - with a 0.1% tolerance the error is reduced by 10 times. Modeling the temperature resistor behavior, the accuracy of measurement device can be less that 0.02degC. To establish the resistor temperature model a thermal imaging analyze is been made and using a microcontroller as a central unit, the temperature error can be eliminate by soft. The PCB components placement and positioning can be also optimized using the thermal image.
  • Keywords
    building; dams; resistors; temperature measurement; temperature sensors; transducers; PCB components; analog-digital convector; dams; electronic components; environment temperature effect; hole resistor; hydro-energetic building resistive transducers; microcontroller; packaging temperature; portable temperature measurement device; self-heating phenomenon; temperature 20 degC to 35 degC; thermal imaging; Electronic components; Electronics packaging; Image analysis; Resistors; Sensor phenomena and characterization; Temperature distribution; Temperature measurement; Temperature sensors; Thermal resistance; Transducers;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics Technology, 2009. ISSE 2009. 32nd International Spring Seminar on
  • Conference_Location
    Brno
  • Print_ISBN
    978-1-4244-4260-7
  • Type

    conf

  • DOI
    10.1109/ISSE.2009.5207035
  • Filename
    5207035