Optimizing technological process for laser soldering of fine-pitch flip chips

Author

Bátorfi, Réka ; Illyefalvi-Vitez, Zsolt ; Krammer, Oliver ; Bunea, Radu ; Svasta, Paul

Author_Institution

Dept. of Electron. Technol., Budapest Univ. of Technol. & Econ., Budapest, Hungary

fYear

2009

fDate

13-17 May 2009

Firstpage

1

Lastpage

6

Abstract

In the frame of EC sponsored RTD projects as well as industrially requested innovation developments the activities of BME-ETT cover the full technology of electronics design, assembling, soldering, process monitoring and testing. This paper presents some important details how a team of BME-ETT has been developing and optimizing the solder paste printing, component placement and laser soldering sequence of processes to assemble flip-chips with 80 mum size bumps onto a polymer substrate with 200 times 200 mum size pads. In particular, the problems and solutions of working out the stencil printing, chip placement, and their testing methods are illustrated and explained in the paper.

Keywords

assembling; fine-pitch technology; flip-chip devices; laser materials processing; printed circuits; soldering; solders; BME-ETT; PCB flip chips; RTD projects; chip placement; component placement; electronics assembling; electronics design; fine-pitch flip chips; laser soldering sequence; optimizing technological process; polymer substrate; process monitoring; size 200 mum; solder paste printing; stencil printing; Assembly; Electronic equipment testing; Electronics industry; Flip chip; Industrial electronics; Monitoring; Printing; Process design; Soldering; Technological innovation;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Technology, 2009. ISSE 2009. 32nd International Spring Seminar on

Conference_Location

Brno

Print_ISBN

978-1-4244-4260-7

Type

conf

DOI

10.1109/ISSE.2009.5207039

Filename

5207039