Investigation of die attach quality in power electronic devices

The lifetime of electronic systems is highly influenced by the quality of the built-in electronic parts, so it is especially important that we could choose from a wide range of parts with the best fit to the conditions of usage. The aim of this paper is to describe what proportion of the die attach of a component will be delaminated beside different conditions. The following factors were taken into account: the physical parameters of the part, the conditions of the assembling and the conditions of the end usage. A test plan was set up with different types of components. Every group of components was separated into subgroups, these subgroups were exposed to different assembling and usage conditions. This test procedure provided information about whether the lead-free reflow process decreases the reliability of the die attach layer.