Title :
MULTI-PRIDE: a system for supporting multi-layered printed wiring board design
Author :
Watanabe, Toshimasa
Author_Institution :
Fac. of Eng., Hiroshima Univ., Japan
Abstract :
The purpose of the paper is to outline MULTI-PRIDE, a system for supporting multi-layered printed wiring board design. It consists of (i) circuit bipartition, (ii) placement and routing on each outside layer, (iii) modification of wiring and compaction, and (iv) routing on inside layers
Keywords :
circuit CAD; network routing; printed circuit design; printed circuit layout; MULTI-PRIDE; circuit bipartition; compaction; multi-layered printed wiring board design; outside layer; placement; routing; wiring; Capacitors; Circuits; Compaction; Design engineering; Resistors; Routing; Systems engineering and theory; Wires; Wiring; Workstations;
Conference_Titel :
Design Automation Conference, 1997. Proceedings of the ASP-DAC '97 Asia and South Pacific
Conference_Location :
Chiba
Print_ISBN :
0-7803-3662-3
DOI :
10.1109/ASPDAC.1997.600124
