Title :
Hybrid integration of InP lasers with SOI waveguides using thermocompression bonding
Author :
Kapulainen, M. ; Ylinen, S. ; Aalto, T. ; Harjanne, M. ; Solehmainen, K. ; Ollila, J. ; Vilokkinen, V.
Author_Institution :
VTT, Espoo
Abstract :
Thermocompression bonding of InP lasers to 4 mum thick SOI waveguides has been demonstrated. Good horizontal alignment is achieved by using active alignment. Excellent passive vertical alignment is reached by using a easily controlled fabrication process.
Keywords :
indium compounds; semiconductor lasers; silicon-on-insulator; tape automated bonding; waveguide lasers; InP; InP lasers; SOI waveguides; active alignment; horizontal alignment; passive vertical alignment; thermocompression bonding; Coatings; Etching; Fiber lasers; Gold; III-V semiconductor materials; Indium phosphide; Optical waveguides; Silicon on insulator technology; Wafer bonding; Waveguide lasers;
Conference_Titel :
Group IV Photonics, 2008 5th IEEE International Conference on
Conference_Location :
Cardiff
Print_ISBN :
978-1-4244-1769-8
Electronic_ISBN :
978-1-4244-1768-1
DOI :
10.1109/GROUP4.2008.4638097
