• DocumentCode
    3013942
  • Title

    Simulation of a thermomechanically actuated gas sensor

  • Author

    Emmenegger, M. ; Taschini, S. ; Korvink, J.G. ; Baltes, H.

  • Author_Institution
    Phys. Electron. Lab., Eidgenossische Tech. Hochschule, Zurich, Switzerland
  • fYear
    1998
  • fDate
    25-29 Jan 1998
  • Firstpage
    184
  • Lastpage
    189
  • Abstract
    The physical dimensions of microsystems make the characteristic times of thermal and mechanical phenomena comparable. Thus, for the first time, we require the coupled analysis of this system. This paper tackles this challenge, presenting a general method to routinely investigate the frequency-domain behaviour of MEMS devices thermo-mechanically excited by an AC heating power. In particular, an application to a gas sensor is presented. For the device we can now correctly determine the amplitude/heating power ratio, given the air and structural damping model, together with the geometry and material description, Characteristics of the method are the use of finite elements for the space-discretization, and spectral analysis for the reduction of mechanical degrees of freedom
  • Keywords
    CMOS integrated circuits; digital simulation; finite element analysis; gas sensors; harmonic analysis; microsensors; semiconductor device models; semiconductor technology; thermoelasticity; AC heating power; MEMS; amplitude/heating power ratio; coupled analysis; finite elements; frequency-domain behaviour; gas sensor; mechanical degrees of freedom; mechanical phenomena; microsystems; physical dimensions; space-discretization,; spectral analysis; structural damping model; thermal phenomena; thermo-mechanical excitation; thermomechanically actuated gas sensor; Damping; Finite element methods; Frequency domain analysis; Gas detectors; Geometry; Microelectromechanical devices; Solid modeling; Space heating; Spectral analysis; Thermomechanical processes;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Micro Electro Mechanical Systems, 1998. MEMS 98. Proceedings., The Eleventh Annual International Workshop on
  • Conference_Location
    Heidelberg
  • ISSN
    1084-6999
  • Print_ISBN
    0-7803-4412-X
  • Type

    conf

  • DOI
    10.1109/MEMSYS.1998.659751
  • Filename
    659751