DocumentCode :
3014886
Title :
Disassembling SLAs for follow-up processes in an SOA system
Author :
Hsu, Chih-Hao ; Liao, Yun-Wei ; Kuo, Chien-Pang
Author_Institution :
Inst. for Inf. Ind., Taipei
fYear :
2008
fDate :
24-27 Dec. 2008
Firstpage :
37
Lastpage :
42
Abstract :
This work presents a novel scheme for Service Level Agreements (SLAs) in a service-oriented architecture (SOA). An SLA is a contract that guarantees quality of service (QoS) between service providers and consumers. An SLA can be split into several parts for an SOA system which is consisting of different services. A split SLA is used to guarantee quality of services for one of services in an SOA system. However, these contract rules do not regulate follow-up process in services. SLA violations may occur consequently. For instance, interactions between services are not encrypted because the encryption parameter isn´t included in the split SLA contract. Confidential data would be transmitted through unsafe channels. There would be a security issue of SLA Management for follow-up processes in an SOA system. The novel scheme in this work addresses these problems. Using SLAs management proposed in this work can identify the services that consumer needs and split the contracts for follow-up services. SLAs are not only guaranteed between service providers and consumers but also assured in follow-up processes. The proposed method improves the security and completeness of SLA using in an SOA system.
Keywords :
quality of service; security of data; software architecture; SOA system; quality of service; security issue; service level agreements; service-oriented architecture; Contracts; Cryptography; Data security; Distributed computing; Internet; Jacobian matrices; Quality of service; Semiconductor optical amplifiers; Service oriented architecture; Web services; Service Level Agreement; Service-oriented architecture;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Computer and Information Technology, 2008. ICCIT 2008. 11th International Conference on
Conference_Location :
Khulna
Print_ISBN :
978-1-4244-2135-0
Electronic_ISBN :
978-1-4244-2136-7
Type :
conf
DOI :
10.1109/ICCITECHN.2008.4803124
Filename :
4803124
Link To Document :
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