A study on EKC265 bath life and fluorine and carbon contamination on bond pads

Author

An, L.H. ; Lai, K.K. ; Chay, W.Y. ; Hua, Y.N.

Author_Institution

Chartered Semicond. Manuf. Ltd., Singapore

fYear

1998

fDate

1998

Firstpage

9

Lastpage

12

Abstract

A study was conducted on EKC265 cleaning bath life. The Auger analysis technique was used to evaluate the contamination levels of fluorine and carbon on the bond pad after the EKC265 process. The results showed that it is necessary and effective to perform EKC265 cleaning for L95 lots. The contamination levels of C and F on the surface (0 Å) of bond pads were about 20 at% and 7.5 at% at the bath life of 40 lots used currently. However, they were 0 at.% at a depth of 50 Å. The results also show that it is possible to extend EKC265 bath life from 40 lots (6 inch) to 50 lots (6 inch) for cost reduction purposes

Keywords

Auger electron spectra; carbon; fluorine; integrated circuit testing; integrated circuit yield; microassembling; surface cleaning; surface contamination; 50 angstrom; 6 in; Auger analysis techniqu; C; EKC265 bath life; EKC265 cleaning; EKC265 cleaning bath life; F; bath life; bond pads; carbon contamination; contamination levels; cost reduction; fluorine; fluorine contamination; Atherosclerosis; Costs; Electrons; Etching; Fabrication; Failure analysis; Measurement standards; Reliability engineering; Surface contamination; Wafer bonding;

fLanguage

English

Publisher

ieee

Conference_Titel

Semiconductor Electronics, 1998. Proceedings. ICSE '98. 1998 IEEE International Conference on

Conference_Location

Bangi

Print_ISBN

0-7803-4971-7

Type

conf

DOI

10.1109/SMELEC.1998.781140

Filename

781140