DocumentCode
3015288
Title
Novel processing of high aspect ratio 1-3 structures of high density PZT
Author
Wang, S.N. ; Li, J.-F. ; Toda, R. ; Watanabe, R. ; Minami, K. ; Esashi, M.
Author_Institution
Tohoku Univ., Sendai, Japan
fYear
1998
fDate
25-29 Jan 1998
Firstpage
223
Lastpage
228
Abstract
A new process for the fabrication of fine scale, high aspect ratio PZT 1-3 composite structures has been developed. In this process, lost mold technique is utilized with a Si mold prepared by deep reactive ion etching (RIE). Due to the high strength and high melting point of Si, PZT sintering under high pressures without removing the mold becomes possible, leading to structures of highly condensed PZT in the precise shape of the mold. The typical PZT structures in this work are periodically arrayed rods 16 μm in diameter, 100 μm in height, resulting in an aspect ratio higher than six. The fabricated structures are to be applied to high resolution micro-ultrasonic transducers in the frequency range of 20 MHz for medical purpose
Keywords
biomedical equipment; biomedical ultrasonics; elemental semiconductors; microsensors; piezoelectric transducers; silicon; sputter etching; ultrasonic transducers; 100 mum; 16 mum; 20 MHz; PZT; PZT 1-3 composite structures; PbZrO3TiO3; RIE; Si mold; deep reactive ion etching; fabricated structures; fabrication; fine scale; high density PZT; hot isostatic pressing; medical purpose; microultrasonic transducers; slurry casting; Biomedical transducers; Etching; Fabrication; Plastics; Polymers; Shape; Slurries; Temperature; Ultrasonic transducer arrays; Ultrasonic transducers;
fLanguage
English
Publisher
ieee
Conference_Titel
Micro Electro Mechanical Systems, 1998. MEMS 98. Proceedings., The Eleventh Annual International Workshop on
Conference_Location
Heidelberg
ISSN
1084-6999
Print_ISBN
0-7803-4412-X
Type
conf
DOI
10.1109/MEMSYS.1998.659758
Filename
659758
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