Localized electrochemical plating of interconnectors for microelectronics

This work demonstrates the electrodeposition of micrometer scale copper structures including columns and interconnectors. Copper interconnectors of 25 μm width were grown within an integrated circuit package using a simple instrument based on the scanning electrochemical microscope. In the present instrument electrodeposition is localized by applying a voltage between a closely spaced glass insulated Pt disk tip (diameter ca. 25 μm) and a substrate, all immersed in a plating solution of acidified CuSO₄. The parameters that affect the deposition process are also addressed