Title :
g-Pack – a generic testbed package for Silicon photonics devices
Author :
Zimmermann, L. ; Schroder, H. ; Tekin, T. ; Bogaerts, W. ; Dumon, P.
Author_Institution :
Fachgebiet Hochfrequenztech. HFT4, Tech. Univ. Berlin, Berlin
Abstract :
g-Pack is a low-frequency packaging approach to breadboarding of silicon photonics chips. It provides optical i/o through a fiber array coupled to gratings couplers, and multiple DC i/o through a pin grid array (PGA) carrier.
Keywords :
diffraction gratings; elemental semiconductors; integrated circuit packaging; integrated optoelectronics; optical arrays; optical fibre couplers; silicon; Si; breadboarding; g-pack; low-frequency packaging; silicon photonics devices; Costs; Electronics packaging; Fiber gratings; Optical arrays; Optical devices; Optical fiber couplers; Optical fiber polarization; Photonics; Silicon; Testing;
Conference_Titel :
Group IV Photonics, 2008 5th IEEE International Conference on
Conference_Location :
Cardiff
Print_ISBN :
978-1-4244-1769-8
Electronic_ISBN :
978-1-4244-1768-1
DOI :
10.1109/GROUP4.2008.4638203
