DocumentCode
3015765
Title
Piezoelectric boundary acoustic waves: Their underlying physics and applications
Author
Hashimoto, Ken-Ya ; Wang, Yiliu ; Omori, Tatsuya ; Yamaguchi, Masatsune ; Kadota, Michio ; Kando, Hajime ; Shibahara, Teruhisa
Author_Institution
Grad. Sch. of Eng., Chiba Univ., Chiba
fYear
2008
fDate
2-5 Nov. 2008
Firstpage
999
Lastpage
1005
Abstract
This paper reviews physical properties of piezoelectric boundary acoustic waves (PBAWs) and their application to miniature and high performance RF filters. First, basic properties of PBAWs are discussed. It is shown that PBAWs are supported in various structures provided that highly piezoelectric material(s) are employed as structural member(s). For example, PBAWs are trapped near the electrode region in the SiO2/heavy grating electrode/rot. YX-LN structure. This means that PBAW properties in the structure are independent of the SiO2 layer thickness. This is a significant advantage for mass production. Rot. YX-LN possesses piezoelectric coupling with the Rayleigh-type PBAW as well as the SH-type one. It is shown that the coupling can be negligible when the device structure is properly designed. The PBAW devices employing SiO2/Au electrodes/0-15degYX-LN are now being mass-produced. Because of the removed cavity from the chip surface, the packaged device size can be reduced dramatically. The minimum insertion loss achieved is comparable to that of conventional SAW filters in a relatively large device size. The SiO2 layer is effective in achieving the improved temperature coefficient of frequency.
Keywords
piezoelectric devices; radiofrequency filters; silicon compounds; surface acoustic wave filters; RF filters; Rayleigh-type PBAW; SAW filters; highly piezoelectric material; insertion loss; piezoelectric boundary acoustic waves; silica layer thickness; silica-heavy grating electrode; Acoustic waves; Electrodes; Filters; Gold; Gratings; Insertion loss; Mass production; Packaging; Physics; Radio frequency;
fLanguage
English
Publisher
ieee
Conference_Titel
Ultrasonics Symposium, 2008. IUS 2008. IEEE
Conference_Location
Beijing
Print_ISBN
978-1-4244-2428-3
Electronic_ISBN
978-1-4244-2480-1
Type
conf
DOI
10.1109/ULTSYM.2008.0242
Filename
4803167
Link To Document