• DocumentCode
    3015961
  • Title

    Progress in CMUTs for HIFU ablation of upper abdominal cancer

  • Author

    Wong, Serena H. ; Kupnik, Mario ; Khuri-Yakub, B.T. ; Watkins, Ronald D. ; Pauly, Kim Butts

  • Author_Institution
    Dept. of Electr. Eng., Stanford Univ., Stanford, CA
  • fYear
    2008
  • fDate
    2-5 Nov. 2008
  • Firstpage
    2068
  • Lastpage
    2071
  • Abstract
    High intensity focused ultrasound (HIFU) guided by magnetic resonance imaging (MRI) is a noninvasive treatment that can potentially reduce morbidity, lower costs, and widen accessibility for patients with upper abdominal cancers. Traditionally, piezoelectric transducers are used for HIFU, but recent developments in capacitive micromachined ultrasonic transducers (CMUTs) have made them competitive. Previously, we designed, fabricated, and tested HIFU CMUTs for use under MRI guidance and demonstrated successful unfocused heating of a HIFU phantom. In this paper, we use this CMUT design in the construction of an 8-element, equal area, concentric ring array for ablation of upper abdominal cancers. We report on the measurement of the beam profile of the transducer and compare it to models; in addition, we report on the effects of acoustic crosstalk on this array.
  • Keywords
    bioMEMS; biomedical MRI; biomedical transducers; cancer; capacitive sensors; micromachining; phantoms; tumours; ultrasonic focusing; ultrasonic therapy; ultrasonic transducer arrays; CMUT design; HIFU ablation; MRI guidance; acoustic crosstalk effects; beam profile measurement; capacitive micromachined ultrasonic transducers; concentric ring array; high-intensity focused ultrasound; magnetic resonance imaging; noninvasive treatment; upper abdominal cancer; Abdomen; Cancer; Costs; Focusing; Magnetic resonance imaging; Medical treatment; Piezoelectric transducers; Testing; Ultrasonic imaging; Ultrasonic transducers; CMUT; HIFU; MR-guidance;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Ultrasonics Symposium, 2008. IUS 2008. IEEE
  • Conference_Location
    Beijing
  • Print_ISBN
    978-1-4244-2428-3
  • Electronic_ISBN
    978-1-4244-2480-1
  • Type

    conf

  • DOI
    10.1109/ULTSYM.2008.0511
  • Filename
    4803175