Title :
Characterization of high-temperature ceramic materials at microwave frequencies for MEMS applications
Author :
Xinhua Ren ; Jiang, Tao ; Wang, Yiguang ; An, Linan ; Gong, Xun
Author_Institution :
Sch. of Electr. Eng. & Comput. Sci., Univ. of Central Florida, Orlando, FL, USA
Abstract :
In this paper, the dielectric constant and loss tangent of two new high-temperature ceramic materials, SiCN and AlPO4, are characterized using a novel measurement technique at microwave frequencies with high accuracy. These ceramic materials exhibit high thermal stabilities and corrosion resistance, enabling their use for high-temperature sensing applications. The dielectric properties of these ceramic materials are critical parameters in order to develop high-temperature sensors for turbine engines. It is found that the dielectric constant and loss tangent of SiCN are 4.358 and 5.26 times 10-3, respectively. For AlPO4, the two parameters are 2.637 and 4.23 times 10-3, respectively. The standard deviation is less than 0.58% for the dielectric constant measurement and less than 5.72% for the loss tangent measurement, demonstrating excellent measurement repeatability.
Keywords :
aluminium compounds; carbon compounds; ceramics; corrosion resistance; dielectric loss measurement; dielectric losses; permittivity; permittivity measurement; silicon compounds; thermal stability; AlPO4; MEMS applications; SiCN; corrosion resistance; dielectric constant; high-temperature ceramic materials; loss tangent; microwave-frequency measurement technique; thermal stability; turbine engine sensor material; Ceramics; Dielectric constant; Dielectric loss measurement; Dielectric materials; Dielectric measurements; Loss measurement; Measurement techniques; Micromechanical devices; Microwave frequencies; Thermal resistance; ceramic; dielectric constant; high temperature; loss tangent; waveguide cavity;
Conference_Titel :
Wireless and Microwave Technology Conference, 2009. WAMICON '09. IEEE 10th Annual
Conference_Location :
Clearwater, FL
Print_ISBN :
978-1-4244-4564-6
Electronic_ISBN :
978-1-4244-4565-3
DOI :
10.1109/WAMICON.2009.5207277