An IEC 61499 based run-to-run controller for chemical mechanical planarization process

Author

Goh, K.M. ; Tjahjono, B. ; Manaf, A. ; Aendenroomer, A.J.R.

Author_Institution

Singapore Inst. of Manuf. Technol., Singapore

fYear

2008

fDate

15-18 Sept. 2008

Firstpage

25

Lastpage

28

Abstract

The paper presented the IEC 61499 based run-to-run controller for chemical mechanical planarization process. Experiments show the needs of adjust the removal rate based on the actual data captured from manufacturing line rather than default values to calculate removal rate for every lot and use removal rate to calculate polish time for the next lot which would be polished next in the polish tool. Two key components of the controller namely removal rate calculation and polish time calculation was developed and the result from both components was captured and analyzed.

Keywords

IEC standards; chemical mechanical polishing; planarisation; semiconductor technology; IEC 61499 based run-to-run controller; chemical mechanical planarization process; polish time; polish time calculation; polish tool; removal rate calculation; Chemical technology; IEC standards; Manufacturing processes; Mechanical variables control; Nonlinear equations; Paper technology; Planarization; Pulp manufacturing; Semiconductor device manufacture; Semiconductor films;

fLanguage

English

Publisher

ieee

Conference_Titel

Emerging Technologies and Factory Automation, 2008. ETFA 2008. IEEE International Conference on

Conference_Location

Hamburg

Print_ISBN

978-1-4244-1505-2

Electronic_ISBN

978-1-4244-1506-9

Type

conf

DOI

10.1109/ETFA.2008.4638364

Filename

4638364