DocumentCode :
3016898
Title :
Self-Organization Method for Coupled Thermo-Mechanical Analysis of Micro-Structure
Author :
Wang, Anlin ; Wu, Xiaofeng ; Zhou, Chenglin ; Ma, Bo
Author_Institution :
Mech. Eng. Coll., Tongji Univ., Shanghai, China
Volume :
1
fYear :
2009
fDate :
7-8 Nov. 2009
Firstpage :
240
Lastpage :
244
Abstract :
In order to solve the multi-physical field calculating respectively, adding the result simply, and low computational efficiency by finite element method for coupled multi-physics fields analysis in micro-electro-mechanical system, we put forward self organization analysis method in this paper. Using cellular automata as a tool, flat-panel in a typical micro-mechanical as a study object, this study transforms a continuous unit into M-shaped truss structure according to strain energy conservation, gets the self-organization evolution rules of thermal stress and electric stress based on double-force pole stress equations, resolves the thermal mechanical,electric mechanical, thermal electric mechanical coupling problems by building the cellular automata model. Finally, the result proves the feasibility and efficiency of self-organization analysis method from computer simulation, provides an effective analysis method for multi-physics fields coupling.
Keywords :
cellular automata; finite element analysis; micromechanical devices; structural engineering; supports; thermal stresses; thermomechanical treatment; M-shaped truss structure; cellular automata; double-force pole stress equations; electric stress; finite element method; microelectromechanical system; microstructure; multiphysics fields analysis; self organization analysis; strain energy conservation; thermal stress; thermomechanical analysis; Capacitive sensors; Computational efficiency; Energy conservation; Energy resolution; Equations; Finite element methods; Microelectromechanical systems; Thermal stresses; Thermomechanical processes; Transforms; CellularAutomata; Electric mechanical coupling; Self-Organization; Thermal electric mechanical coupling; Thermal mechanical coupling;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Artificial Intelligence and Computational Intelligence, 2009. AICI '09. International Conference on
Conference_Location :
Shanghai
Print_ISBN :
978-1-4244-3835-8
Electronic_ISBN :
978-0-7695-3816-7
Type :
conf
DOI :
10.1109/AICI.2009.226
Filename :
5376112
Link To Document :
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