• DocumentCode
    3017423
  • Title

    Surface Defects Inspection System Based on Machine Vision

  • Author

    Deng, Xiaoyan ; Ye, Xiaojuan ; Fang, Jinsheng ; Lin, Chun ; Wang, Lei

  • Author_Institution
    Dept. of Mech. & Electr. Eng., Xiamen Univ., Xiamen, China
  • fYear
    2010
  • fDate
    25-27 June 2010
  • Firstpage
    2205
  • Lastpage
    2208
  • Abstract
    A machine vision based tinplate surface inspection system was developed. The system was composed of two parallel line scan CCD cameras, a special designed wide field illumination, which can overcome the vibration of tinplate, and a software based on SOM (Self-Organizing Feature Map) neural network. The images of tinplate were captured by cameras. All kinds of defects candidates such as pinholes, scallops, dust and scratches were found out, and their features can be extracted and selected from images. These candidates were distinguished by the SOM neural network to find out real defects. The inspection speed reached up to 1.4 m/s, and the resolution was 0.1 mm, and recognition rate was 95.45%.
  • Keywords
    CCD image sensors; computer vision; feature extraction; image resolution; inspection; metallurgical industries; object recognition; plates (structures); production engineering computing; self-organising feature maps; tin; dust; feature extraction; feature selection; image resolution; machine vision; neural network; object recognition; parallel line scan CCD camera; pinholes; scallops; scratches; self-organizing feature map; surface defect inspection system; tinplate image capture; tinplate surface inspection system; tinplate vibration; wide field illumination; Artificial neural networks; Cameras; Feature extraction; Inspection; Lighting; Machine vision; Neurons; SOM neural network; machine vision; tinplate;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical and Control Engineering (ICECE), 2010 International Conference on
  • Conference_Location
    Wuhan
  • Print_ISBN
    978-1-4244-6880-5
  • Type

    conf

  • DOI
    10.1109/iCECE.2010.543
  • Filename
    5631800