DocumentCode
3017502
Title
A novel overlapping coil structure for dual band telemetry system
Author
Wang, Peijun ; Tang, Yina ; Wang, Hui ; Wang, Guoxing
Author_Institution
Sch. of Microelectron., Shanghai Jiao Tong Univ., Shanghai, China
fYear
2012
fDate
20-23 May 2012
Firstpage
2191
Lastpage
2194
Abstract
In this paper, a novel overlapping coil structure for dual band power and data telemetry systems is proposed. Through carefully choosing the coil structural parameters, overlapping structure can achieve both low power interference and ease of manufacturing at the same time. Two design examples are presented and analyzed. Compared with conventional structures which set coils on the same plane, the overlapping structure shows higher power interference rejection and better overall signal quality.
Keywords
coils; interference (signal); telemetry; data telemetry system; dual band power; interference rejection; overlapping coil structural parameter; signal quality; Attenuation; Coils; Couplings; Dual band; Implants; Interference; Telemetry;
fLanguage
English
Publisher
ieee
Conference_Titel
Circuits and Systems (ISCAS), 2012 IEEE International Symposium on
Conference_Location
Seoul
ISSN
0271-4302
Print_ISBN
978-1-4673-0218-0
Type
conf
DOI
10.1109/ISCAS.2012.6271724
Filename
6271724
Link To Document