DocumentCode
3017613
Title
Small-sized SAW duplexers with wide duplex gap on a SiO2 /Al/LiNbO3 structure by using novel Rayleigh-mode spurious suppression technique
Author
Nakanishi, H. ; Nakamura, H. ; Hamaoka, Y. ; Kamiguchi, H. ; Iwasaki, Y.
Author_Institution
Corp. Components Dev. Center, Panasonic Electron. Devices Co., Ltd., Osaka
fYear
2008
fDate
2-5 Nov. 2008
Firstpage
1588
Lastpage
1591
Abstract
This paper describes the novel Rayleigh-mode spurious suppression technique for SAW duplexers with wide duplex gap on a SiO2/Al/LiNbO3 structure. We have cleared the optimum shape of SiO2 with taking account of the difference of the electrode thickness. The shape of SiO2 which can suppress the spurious depended on the thickness of Al electrode. By controlling the shape of SiO2, the Rayleigh-mode spurious of both Band I and Band IV duplexers can be suppressed. The small-sized SAW duplexers for Band I and Band IV systems were realized by employing this technology and optimizing the thickness of Al electrode. Our duplexers show the excellent performances for actually use. Insertion loss of transmitting band for Band I and for Band IV are 1.2 dB and 1.3 dB. And, the TCF is about -30 ppm/degC. The size of these duplexers is 2.5 mm times 2.0 mm. Additionally, the duplexers have sufficient power durability by using the multi-layer electrodes of AlMgCu/Ti.
Keywords
aluminium; aluminium alloys; copper alloys; electrodes; lithium compounds; magnesium alloys; multilayers; multiplexing equipment; silicon compounds; surface acoustic wave devices; titanium; AlMgCu-Ti; Band I duplexer system; Band IV duplexer system; Rayleigh-mode spurious suppression technique; SiO2-Al-LiNbO3; insertion loss; multilayer electrodes; power durability; small-sized SAW duplexers; wide duplex gap; 3G mobile communication; Artificial intelligence; Attenuation; Circuits; Electrodes; Frequency; Insertion loss; Propagation losses; Shape control; Surface acoustic waves; Band I; Band IV; Duplexer; Rayleigh-mode spurious; the shape of SiO2 ;
fLanguage
English
Publisher
ieee
Conference_Titel
Ultrasonics Symposium, 2008. IUS 2008. IEEE
Conference_Location
Beijing
Print_ISBN
978-1-4244-2428-3
Electronic_ISBN
978-1-4244-2480-1
Type
conf
DOI
10.1109/ULTSYM.2008.0387
Filename
4803247
Link To Document