Title :
Advanced determination of piezoelectric properties of AlN thin films on silicon substrates
Author :
Sánchez-Rojas, J.L. ; Hernando, J. ; Ababneh, A. ; Schmid, U. ; Olivares, J. ; Clement, M. ; Iborra, E.
Author_Institution :
Dipt. Ing. Electr. Electron., Univ. de Castilla La Mancha, Ciudad Real
Abstract :
Piezoelectric deformations of thin, aluminum nitride (AlN) layers, on top of a silicon substrate, were studied by numerical calculations and interferometric measurements. Our calculation by finite element method demonstrates that substrate deformation under the top electrode may be comparable to the electric field induced deformation in the thin AlN layer, for a given applied voltage. Simulations also show the effect of a clamped or free substrate condition and the relative contributions of d33 and d31 piezoelectric constants. A Laser scanning vibrometry technique was used to measure deformations in the top surface with sub-picometer vertical resolution. By comparing calculations and experimental data, quantitative information about both d33 and d31 constants can be obtained.
Keywords :
III-V semiconductors; aluminium compounds; deformation; electrodes; elemental semiconductors; finite element analysis; measurement by laser beam; piezoelectricity; semiconductor growth; semiconductor thin films; silicon; sputtered coatings; wide band gap semiconductors; AlN; Si; d31 piezoelectric constant; d33 piezoelectric constant; electric field induced deformation; finite element method; interferometric measurement; laser scanning vibrometry technique; molybdenum electrode; piezoelectric properties determination; sputter deposited aluminium nitride thin film; sub-picometer vertical resolution; Aluminum nitride; CMOS technology; Chemical technology; Electrodes; Finite element methods; Piezoelectric films; Semiconductor thin films; Silicon; Substrates; Voltage; Aluminum Nitride; Piezoelectric constants; vibrometer;
Conference_Titel :
Ultrasonics Symposium, 2008. IUS 2008. IEEE
Conference_Location :
Beijing
Print_ISBN :
978-1-4244-2428-3
Electronic_ISBN :
978-1-4244-2480-1
DOI :
10.1109/ULTSYM.2008.0218