DocumentCode
3018277
Title
Temperature treatment on Silicon Nanowires for reliability studies
Author
Willems, Nathan ; Wejinya, Uche ; Zhuxin Dong
Author_Institution
Dept. of Micro Electron. & Photonics, Univ. of Arkansas, Fayetteville, AR, USA
fYear
2013
fDate
5-8 Aug. 2013
Firstpage
321
Lastpage
324
Abstract
Material reliability is among the crucial factors that impact material performances before device applications. In order to predict material reliability, accelerated aging study-a study to predict material shelf life when subjected to temperature, was performed on Silicon Nanowires. We investigated the effects of process conditions on the diameters and the quality of Si NWs using Atomic Force Microscopy. The experimental results revealed diameter of Si NWs has linear relationship with varying temperature. These results are of significant importance and will be a critical design consideration for the manufacture of Nanoelectromechanical systems involving Si NWs.
Keywords
ageing; annealing; atomic force microscopy; nanoelectromechanical devices; nanowires; reliability; semiconductor quantum wires; silicon; Si; Si nanowire diameter; accelerated aging study; atomic force microscopy; crucial factors; design consideration; device application; material performance; material reliability; material shelf life; nanoelectromechanical systems; process condition effects; reliability studies; temperature treatment; Accelerated aging; Nanowires; Reliability; Silicon; Temperature;
fLanguage
English
Publisher
ieee
Conference_Titel
Nanotechnology (IEEE-NANO), 2013 13th IEEE Conference on
Conference_Location
Beijing
ISSN
1944-9399
Print_ISBN
978-1-4799-0675-8
Type
conf
DOI
10.1109/NANO.2013.6720984
Filename
6720984
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