DocumentCode :
3018336
Title :
Standard bus vs. bus wrapper: what is the best solution for future SoC integration?
Author :
Yeung, C. ; Matthews, G. ; Morris, J. ; Haverinen, A. ; Zaidi, J.
Author_Institution :
VSI Alliance
fYear :
2001
fDate :
13-16 March 2001
Firstpage :
776
Lastpage :
776
Abstract :
A number of companies have promoted their on-chip busses as potential standards for the SoC industry. VSIA??s On-Chip Bus Development Working Group chooses to develop a Standard Bus Wrapper (VCI) as opposed to endorsing a single bus as the standard. Standard Bus advocates claim Wrappers incur performance and area overhead. Bus Wrapper advocates claim no single On-Chip Bus will meet the needs of all SoCs. Will a single bus emerge, and if not where should a standard wrapper be used? Which is the correct approach for future SoC Integration? This panel will include experts from both of these perspectives, to discuss the pros and cons of their positions.
Keywords :
Costs; Design methodology; Investments; Microelectronics; Microprocessors; Protection; Standards development; System-on-a-chip;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Design, Automation and Test in Europe, 2001. Conference and Exhibition 2001. Proceedings
Conference_Location :
Munich, Germany
ISSN :
1530-1591
Print_ISBN :
0-7695-0993-2
Type :
conf
DOI :
10.1109/DATE.2001.915119
Filename :
915119
Link To Document :
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