Thermal design of a desktop computer system using CFD analysis

Author

Yu, C.-W. ; Webb, R.L.

Author_Institution

Fluent Inc., Lebanon, NH, USA

fYear

2001

fDate

2001

Firstpage

18

Lastpage

26

Abstract

This paper uses CFD (Icepak) to identify a cooling solution for a desktop computer, which uses an 80 W CPU. The design is based on a total chassis power dissipation of 313 W (40 W PCI cards). This represents significant power dissipation for the chassis components (memory, chipset, AGP and PCI cards, and peripherals). The analysis is also extended to 100 W PCI power. Of key interest is minimization of the chassis air flow requirements. The design is able to cool the chassis with one case fan and the power supply fan. A ducted 80×60 mm CPU heat sink is able to meet the CPU temperature specification. System level design improvements were made to provide better cooling for AGP and PCI cards

Keywords

add-on boards; computational fluid dynamics; cooling; electronic design automation; heat sinks; integrated circuit packaging; memory cards; microcomputers; thermal analysis; thermal management (packaging); thermal resistance; 100 W; 313 W; 40 W; 60 mm; 80 W; 80 mm; AGP cards; CFD analysis; CPU; CPU temperature specification; Icepak CFD; PCI cards; PCI power; case fan; chassis air flow requirements minimization; chassis components; chipset; cooling; desktop computer system; ducted CPU heat sink; memory; peripherals; power dissipation; power supply fan; system level design; thermal design; total chassis power dissipation; Central Processing Unit; Computational fluid dynamics; Cooling; Electronic packaging thermal management; Heat sinks; Power dissipation; Power supplies; Temperature; Thermal resistance; Trigeneration;

fLanguage

English

Publisher

ieee

Conference_Titel

Semiconductor Thermal Measurement and Management, 2001. Seventeenth Annual IEEE Symposium

Conference_Location

San Jose, CA

Print_ISBN

0-7803-6649-2

Type

conf

DOI

10.1109/STHERM.2001.915139

Filename

915139