Title :
A high-speed thermal imaging system for semiconductor device analysis
Author :
Hefner, A. ; Berning, D. ; Blackburn, D. ; Chapuy, C. ; Bouché, S.
Author_Institution :
Semicond. Electron. Div., Nat. Inst. of Stand. & Technol., Gaithersburg, MD, USA
Abstract :
A new high-speed transient thermal imaging system is presented that provides the capability to measure the transient temperature distributions on the surface of a semiconductor chip with 1 μs time, and 15 μm spatial resolution. The system uses virtual instrument graphical user interface software that controls an infrared thermal microscope, translation stages, a digitizing oscilloscope, and a device test fixture temperature controller. The computer interface consists of a front panel for viewing the temperature distribution and includes a movie play-back feature that enables viewing of the temperature distribution versus time. The computer user interface also has a sub-panel for emissivity mapping and calibration of the infrared detector. The utility of the system is demonstrated in this paper using a bipolar transistor hotspot current constriction process
Keywords :
calibration; digital storage oscilloscopes; emissivity; failure analysis; graphical user interfaces; infrared detectors; infrared imaging; optical microscopy; power MOSFET; power bipolar transistors; semiconductor device reliability; semiconductor device testing; temperature control; temperature distribution; thermal analysis; transient analysis; virtual instrumentation; bipolar transistor hotspot current constriction process; computer interface; computer user interface; device test fixture temperature controller; digitizing oscilloscope; emissivity mapping; front panel; high-speed thermal imaging system; infrared detector calibration; infrared thermal microscope; movie play-back feature; power MOSFET; power bipolar transistor; semiconductor chip surface; semiconductor device analysis; spatial resolution; temperature distribution viewing; time resolution; transient temperature distributions; transient thermal imaging system; translation stages; virtual instrument graphical user interface software; Computer interfaces; Control systems; High-resolution imaging; Optical imaging; Semiconductor device measurement; Semiconductor devices; Temperature control; Temperature distribution; Temperature measurement; Time measurement;
Conference_Titel :
Semiconductor Thermal Measurement and Management, 2001. Seventeenth Annual IEEE Symposium
Conference_Location :
San Jose, CA
Print_ISBN :
0-7803-6649-2
DOI :
10.1109/STHERM.2001.915143
