Thermal characterization of fan-heat sink systems in miniature axial fan and micro blower airflow

Author

Loh, C.K. ; Nelson, Dan ; Chou, D.J.

Author_Institution

Enerton Inc., Mesa, AZ, USA

fYear

2001

fDate

2001

Firstpage

111

Lastpage

116

Abstract

In portable electronics, the thermal management system must be optimized to attain the highest performance in the given space and under the given constraints. The greater the number of fins, the higher the surface area will be, thus aiding forced convection. However, by increasing the number of fins within the same available space, the performance of the fans or blowers will be degraded. The primary goal of the paper is to determine the optimization point for several different fan-heat sink combinations. The secondary goal is to find a theoretical methodology that will simulate the natural phenomena, thus obtaining the ability to optimize the system without experimentation

Keywords

forced convection; heat sinks; integrated circuit measurement; integrated circuit modelling; integrated circuit packaging; integrated circuit reliability; optimisation; thermal management (packaging); blower performance; fan performance; fan-heat sink combinations; fan-heat sink systems; forced convection; heat sink fins; micro blower airflow; miniature axial fan airflow; natural phenomena simulation; optimization point; package constraints; package space; portable electronics; surface area; system optimization; thermal characterization; thermal management system optimization; Assembly; Consumer electronics; Fans; Heat sinks; Heat transfer; Resistance heating; Thermal conductivity; Thermal expansion; Thermal management of electronics; Thermal resistance;

fLanguage

English

Publisher

ieee

Conference_Titel

Semiconductor Thermal Measurement and Management, 2001. Seventeenth Annual IEEE Symposium

Conference_Location

San Jose, CA

Print_ISBN

0-7803-6649-2

Type

conf

DOI

10.1109/STHERM.2001.915158

Filename

915158