Title :
Two-phase microchannel heat sinks for an electrokinetic VLSI chip cooling system
Author :
Jiang, Linan ; Koo, Jae-Mo ; Zeng, Shulin ; Mikkelsen, James C. ; Zhang, Lian ; Zhou, Peng ; Santiago, Juan G. ; Kenny, Thomas W. ; Goodson, Kenneth E. ; Maveety, James G. ; Tran, Quan A.
Author_Institution :
Dept. of Mech. Eng., Stanford Univ., CA, USA
Abstract :
The trend towards higher speed and greater integration of modern ICs requires improved cooling technology. This paper describes the design and characterization of a two-phase microchannel heat sink in an electrokinetic VLSI chip cooling system. The heat sink achieves a thermal resistance of 1 K/W for a 1.2 cm×1.2 cm silicon thermal test chip under open-loop operation with a water flow-rate of 5 ml/min. Preliminary tests show that a closed-loop EK-pumped system running at 1.2 ml/min and 12 psi removes 17.3 W, with heat rejection at an aluminum fin array. Further optimization of the microchannel dimensions and the working fluid operating pressure are expected to lower the resistance below 0.25 K/W
Keywords :
VLSI; cooling; electrokinetic effects; heat sinks; integrated circuit packaging; optimisation; pumps; thermal management (packaging); thermal resistance; 1.2 cm; 12 psi; 17.3 W; Al; IC integration; IC speed; Si; aluminum fin array; closed-loop EK-pumped system; cooling technology; electrokinetic VLSI chip cooling system; heat rejection; heat removal; heat sink thermal resistance; microchannel dimensions; open-loop operation; optimization; silicon thermal test chip; two-phase microchannel heat sink design; two-phase microchannel heat sinks; water flow-rate; working fluid operating pressure; Cooling; Electrokinetics; Heat sinks; Microchannel; Resistance heating; Silicon; Testing; Thermal resistance; Very large scale integration; Water heating;
Conference_Titel :
Semiconductor Thermal Measurement and Management, 2001. Seventeenth Annual IEEE Symposium
Conference_Location :
San Jose, CA
Print_ISBN :
0-7803-6649-2
DOI :
10.1109/STHERM.2001.915168
