DocumentCode
3019688
Title
Is the road towards “Zero-Energy” paved with NEMFET-based power management?
Author
Enachescu, Marius ; Voicu, George R. ; Cotofana, Sorin D.
Author_Institution
Comput. Eng. Lab., Delft Univ. of Technol., Delft, Netherlands
fYear
2012
fDate
20-23 May 2012
Firstpage
2561
Lastpage
2564
Abstract
In this paper we explore the potential that the use of state-of-the-art Nano-Electro-Mechanical (NEM) devices, i.e., NEMFETs and NEM Relays, in the implementation of power management circuitry, in combination with efficient energy harvesters through 3D stacking integration, have in meeting the tight energy budgets of “Zero-Energy” autonomous sensor systems. We propose various 3D hybrid embodiments of an openMPS430 embedded processor augmented with NEMFET and/or NEM Relay based power management mechanisms and investigate their energy consumption when executing a heart beat detection application. Our investigations indicate that the hybrid NEMFET-oriented approach, which relies on sleep transistors and associated management logic implemented on a dedicated NEMFET die, is the most promising in terms of energy consumption and reliability. Moreover, when combined with a thermal energy harvester, potentially implementable on the same die, it can enable the road towards autonomous computing.
Keywords
MOSFET; biomedical transducers; body sensor networks; energy harvesting; energy management systems; integrated circuit reliability; intelligent sensors; microprocessor chips; nanosensors; relays; semiconductor device reliability; three-dimensional integrated circuits; 3D hybrid embodiment; 3D stacking integration; NEM device; NEM relay; NEMFET die; associated management logic; energy consumption; heart beat detection application; hybrid NEMFET-oriented approach; nanoelectromechanical device; openMPS430 embedded processor; power management circuitry; reliability; sleep transistor; thermal energy harvester; zero-energy autonomous sensor system; CMOS integrated circuits; Photovoltaic systems; Power supplies; Radio frequency; Thermal sensors; Vibrations;
fLanguage
English
Publisher
ieee
Conference_Titel
Circuits and Systems (ISCAS), 2012 IEEE International Symposium on
Conference_Location
Seoul
ISSN
0271-4302
Print_ISBN
978-1-4673-0218-0
Type
conf
DOI
10.1109/ISCAS.2012.6271826
Filename
6271826
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